With features of high temperature resistance, corrosion resistance, abrasion resistance and insulation, ceramic can work in many kinds of semiconductor production equipment with condition of high temperature, vacuum or corrosive gas for a long time. Made from high-purity alumina powder, processed by cold isostatic pressing, high temperature sintering and precision finishing, it could reach the dimension tolerance to ±0.001 mm, surface finish Ra 0.1, temperature resistance 1600℃. Here is the characteristics of alumina ceramic with different purity.Spray Granulation →ceramic powder → Forming → Blank Sintering → Rough grinding → CNC Machining → Fine Grinding → Dimension Inspection → Cleaning → PackingPlace of Origin: Hunan, China Material: Alumina Ceramic HS Code: 85471000 Supply Ability: 200 pcs per month Lead time: 3-4 weeks Package: Corrugated box, foam, carton Others: Customization service available1. About price: The price is negotiable. It can be changed according to your quantity or package. 2. About MOQ: We can adjust it according to your requirement. 3. High quality: Using high quality material and establishing a strict quality control system, assigning specific persons in charge of each process of production, from raw material purchase to pack. 4. We offer the best service as we have. Experienced sales team are already to work for you. 5. How can we guarantee quality? Always 100% Inspection before shipment; 6. What certification you have? We are ISO 9001 Quality Management System Certificated company. 7. What services can we provide? Accepted Delivery Terms: FOB,EXW； Accepted Payment Currency: USD, CNY; Accepted Payment Type: T/T Language Spoken: English, Chinese 8. What is your delivery time? A: Normally, our delivery time is within 30 days after confirmation. 9. There are so many suppliers, why choose you as our business partner? We focus on ceramic parts manufacturing for over 15years, that is to say we also have accumulated 15years OEM experience.ble to grip and transport a warped wafer securely. Free from contact with the wafer except a periphery, so it won't leave grip marks and give uneven stress. Minimized contact area within 3mm periphery made the surface less likely to cause particles. Due to built-in air channel in a single piece body with no adhesives and metal cover, the structure becomes more durable and chemically stable under heated environments.